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Immersion Cooling Fluids
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
$3,000.00 -
Insulated Metal Substrate
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
$3,000.00 -
Multi-Layer Thermal Clad PCB
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
$3,000.00 -
Surface Mount Thermal Bridge
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
$3,000.00 -
Thermal Clad Dielectric Materials
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
$3,000.00