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View wishlist“Fusion Application Daughter Board (EVM577PFUSION-V1-0)” has been added to your wishlist
OSI Electronics provides complete flex circuit and rigid-flex design, fabrication, and flex assembly solutions.
Fusion Application Board
Reliably connect the fusion board to SK-TDA4VM (Starter kit) using this Kit. This Kit includes a bracket , mounting hardware, power cable and connector and also instructions on how to connect the platforms together.
The SCIM1001 (Signal Conditioning Interface Module) is used to match the input and output characteristics of the AN/ARC-210 Integrated Communication System with digital subsystems in both air vehicle and ground support equipment. The Signal Conditioner inputs RS-422 UCARS-V2 asynchronous data and conditions it to meet the ARC-210 Black Wideband Transmit data requirement. The SCIM provides an interface for five DCP TX/RX pairs. Four of these signal pairs are routed to interface modules inside the SCIM for conversion to the appropriate levels for the ARC-210 while the fifth interface pair is routed directly to a UCARS interface connector. The module is powered with 28 Volts DC and it also creates the WB data input select and retransmit key signals. These discrete signals are active low enabling and are required by the RT-1794 ARC-210 for the Black Wideband Data Transmission per the IDS-988-6499-001 RT-1794 Interface Design Specification.
Our high-quality Printed Circuit Board Assembly (PCBA) solutions are engineered for industrial, automotive, medical, telecommunications, and consumer electronics applications. We provide reliable PCB manufacturing, precision SMT & THT assembly, component sourcing, testing, and complete turnkey production with strict quality standards.
OSI Electronics provides complete flex circuit and rigid-flex design, fabrication, and flex assembly solutions.
Fusion Application Board
Reliably connect the fusion board to SK-TDA4VM (Starter kit) using this Kit. This Kit includes a bracket , mounting hardware, power cable and connector and also instructions on how to connect the platforms together.
The SCIM1001 (Signal Conditioning Interface Module) is used to match the input and output characteristics of the AN/ARC-210 Integrated Communication System with digital subsystems in both air vehicle and ground support equipment. The Signal Conditioner inputs RS-422 UCARS-V2 asynchronous data and conditions it to meet the ARC-210 Black Wideband Transmit data requirement. The SCIM provides an interface for five DCP TX/RX pairs. Four of these signal pairs are routed to interface modules inside the SCIM for conversion to the appropriate levels for the ARC-210 while the fifth interface pair is routed directly to a UCARS interface connector. The module is powered with 28 Volts DC and it also creates the WB data input select and retransmit key signals. These discrete signals are active low enabling and are required by the RT-1794 ARC-210 for the Black Wideband Data Transmission per the IDS-988-6499-001 RT-1794 Interface Design Specification.
Our high-quality Printed Circuit Board Assembly (PCBA) solutions are engineered for industrial, automotive, medical, telecommunications, and consumer electronics applications. We provide reliable PCB manufacturing, precision SMT & THT assembly, component sourcing, testing, and complete turnkey production with strict quality standards.
Our high-quality Printed Circuit Board Assembly (PCBA) solutions are engineered for industrial, automotive, medical, telecommunications, and consumer electronics applications. We provide reliable PCB manufacturing, precision SMT & THT assembly, component sourcing, testing, and complete turnkey production with strict quality standards.
OSI Electronics provides complete flex circuit and rigid-flex design, fabrication, and flex assembly solutions.
Fusion Application Board
Reliably connect the fusion board to SK-TDA4VM (Starter kit) using this Kit. This Kit includes a bracket , mounting hardware, power cable and connector and also instructions on how to connect the platforms together.
ASC has extensive experience and technical expertise in the manufacturing of time critical, high technology RF circuits.
ASC proudly offers advanced RF microwave PCBs that use high frequency and heat sink technologies. We have extensive experience and technical expertise in the manufacturing of time critical, high technology RF circuits. We work closely with our worldwide customers to deliver prototype-to-high volume manufacturing of RF microwave PCBs.
Some of the suppliers of laminate / dielectric materials we utilize are: Nelco, Rogers, Isola, & Taconic. We manufacture high frequency PCBs with metal heat sinks for the telecommunication and aerospace industries. The heat sinks and RF Microwave PCBs are typically connected thermally and electrically. The metal heat sinks help with thermal dissipation and grounding of circuits. ASC uses commercially available pre-bonded and post-bonded materials for our RF microwave PCBs. Pre-bonded laminates are typically supplied by Rogers, Isola, or Taconic. Post-bonding is done via commercially available sheet film adhesive materials, ASC’s patented sheet film adhesives or sweat solder.
The SCIM1001 (Signal Conditioning Interface Module) is used to match the input and output characteristics of the AN/ARC-210 Integrated Communication System with digital subsystems in both air vehicle and ground support equipment. The Signal Conditioner inputs RS-422 UCARS-V2 asynchronous data and conditions it to meet the ARC-210 Black Wideband Transmit data requirement. The SCIM provides an interface for five DCP TX/RX pairs. Four of these signal pairs are routed to interface modules inside the SCIM for conversion to the appropriate levels for the ARC-210 while the fifth interface pair is routed directly to a UCARS interface connector. The module is powered with 28 Volts DC and it also creates the WB data input select and retransmit key signals. These discrete signals are active low enabling and are required by the RT-1794 ARC-210 for the Black Wideband Data Transmission per the IDS-988-6499-001 RT-1794 Interface Design Specification.