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TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
The SMTC engineering services team delivers a full range of design, engineering and manufacturing solutions across all our market sectors.
OSI Electronics offers turnkey solutions for the full range of assembly complexity. We partner with Customers on Product Development, New Product Introduction, Mass Production, Sustaining Engineering and Product Lifecycle Management. Our cutting edge technology, manufacturing proficiency and responsive technical services deliver the Tier One capabilities Customers require.
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
SMTC provides a broad range of Post-Production Services which enables our customers to minimize inventory exposure, eliminate multiple administrative costs, and increase response time to their own customers.
Our engineers can work as part of your team or take on complete product designs for you. Through close integration with our manufacturing group, we ensure that projects transition efficiently from design to prototype and into production.
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
The SMTC engineering services team delivers a full range of design, engineering and manufacturing solutions across all our market sectors.
OSI Electronics offers turnkey solutions for the full range of assembly complexity. We partner with Customers on Product Development, New Product Introduction, Mass Production, Sustaining Engineering and Product Lifecycle Management. Our cutting edge technology, manufacturing proficiency and responsive technical services deliver the Tier One capabilities Customers require.
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
SMTC provides a broad range of Post-Production Services which enables our customers to minimize inventory exposure, eliminate multiple administrative costs, and increase response time to their own customers.
Our engineers can work as part of your team or take on complete product designs for you. Through close integration with our manufacturing group, we ensure that projects transition efficiently from design to prototype and into production.
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
Flexible solutions including quick-turn PCB assembly, turnkey production, and consignment builds.
OSI Electronics offers turnkey solutions for the full range of assembly complexity. We partner with Customers on Product Development, New Product Introduction, Mass Production, Sustaining Engineering and Product Lifecycle Management. Our cutting edge technology, manufacturing proficiency and responsive technical services deliver the Tier One capabilities Customers require.
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
SMTC provides a broad range of Post-Production Services which enables our customers to minimize inventory exposure, eliminate multiple administrative costs, and increase response time to their own customers.
Prototype to production PCB design, from simple boards to complex multi-layer layouts
DFM-first approach to reduce respins, control cost, and improve yield
All technologies: single/double-sided, multi-layer, rigid, flex, and rigid-flex
Critical routing expertise for analog, digital, and mixed-signal designs
Analysis-driven optimization: signal integrity and thermal review (high-speed/RF capable)
Manufacturing-ready handoff: BOM + footprint review, alternate risk checks, and full fab/assembly outputs (Gerbers/ODB++, PnP, drawings)
The SCIM1001 (Signal Conditioning Interface Module) is used to match the input and output characteristics of the AN/ARC-210 Integrated Communication System with digital subsystems in both air vehicle and ground support equipment. The Signal Conditioner inputs RS-422 UCARS-V2 asynchronous data and conditions it to meet the ARC-210 Black Wideband Transmit data requirement. The SCIM provides an interface for five DCP TX/RX pairs. Four of these signal pairs are routed to interface modules inside the SCIM for conversion to the appropriate levels for the ARC-210 while the fifth interface pair is routed directly to a UCARS interface connector. The module is powered with 28 Volts DC and it also creates the WB data input select and retransmit key signals. These discrete signals are active low enabling and are required by the RT-1794 ARC-210 for the Black Wideband Data Transmission per the IDS-988-6499-001 RT-1794 Interface Design Specification.
Global sourcing, vendor management, and logistics solutions that reduce risk and keep your projects moving.
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats