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Compare“Fusion Application Daughter Board (EVM577PFUSION-V1-0)” has been added to the compare list
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
Costed BOM & quoting: line-item pricing, lead times, MOQs, and availability so you can make fast decisions
BOM scrub + data cleanup: validate part numbers/packaging/AML details so what’s on the BOM can actually be sourced and built
Lifecycle & shortage risk checks: flag NRND/EOL parts early and plan replacements before they become blockers
Alternates & second-sourcing: recommend vetted substitutes to reduce cost and lead time without breaking form/fit/function
Authenticity + traceability (on request): prioritize authorized sources when possible, with inspection/testing options and CoC/traceability documentation
Kitting + logistics coordination: consolidate parts into build-ready kits and align delivery to your PCB/battery build schedule
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
Costed BOM & quoting: line-item pricing, lead times, MOQs, and availability so you can make fast decisions
BOM scrub + data cleanup: validate part numbers/packaging/AML details so what’s on the BOM can actually be sourced and built
Lifecycle & shortage risk checks: flag NRND/EOL parts early and plan replacements before they become blockers
Alternates & second-sourcing: recommend vetted substitutes to reduce cost and lead time without breaking form/fit/function
Authenticity + traceability (on request): prioritize authorized sources when possible, with inspection/testing options and CoC/traceability documentation
Kitting + logistics coordination: consolidate parts into build-ready kits and align delivery to your PCB/battery build schedule
Reliably connect the fusion board to SK-TDA4VM (Starter kit) using this Kit. This Kit includes a bracket , mounting hardware, power cable and connector and also instructions on how to connect the platforms together.
Fusion Application Board
OSI Electronics provides complete flex circuit and rigid-flex design, fabrication, and flex assembly solutions.
Our displays division provides a wealth of experience in the design and fabrication of custom LCD and TFT modules and Display Assemblies for several industries.
Our engineers can work as part of your team or take on complete product designs for you. Through close integration with our manufacturing group, we ensure that projects transition efficiently from design to prototype and into production.
OSI Electronics offers turnkey solutions for the full range of assembly complexity. We partner with Customers on Product Development, New Product Introduction, Mass Production, Sustaining Engineering and Product Lifecycle Management. Our cutting edge technology, manufacturing proficiency and responsive technical services deliver the Tier One capabilities Customers require.
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges