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TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
Costed BOM & quoting: line-item pricing, lead times, MOQs, and availability so you can make fast decisions
BOM scrub + data cleanup: validate part numbers/packaging/AML details so what’s on the BOM can actually be sourced and built
Lifecycle & shortage risk checks: flag NRND/EOL parts early and plan replacements before they become blockers
Alternates & second-sourcing: recommend vetted substitutes to reduce cost and lead time without breaking form/fit/function
Authenticity + traceability (on request): prioritize authorized sources when possible, with inspection/testing options and CoC/traceability documentation
Kitting + logistics coordination: consolidate parts into build-ready kits and align delivery to your PCB/battery build schedule
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
Costed BOM & quoting: line-item pricing, lead times, MOQs, and availability so you can make fast decisions
BOM scrub + data cleanup: validate part numbers/packaging/AML details so what’s on the BOM can actually be sourced and built
Lifecycle & shortage risk checks: flag NRND/EOL parts early and plan replacements before they become blockers
Alternates & second-sourcing: recommend vetted substitutes to reduce cost and lead time without breaking form/fit/function
Authenticity + traceability (on request): prioritize authorized sources when possible, with inspection/testing options and CoC/traceability documentation
Kitting + logistics coordination: consolidate parts into build-ready kits and align delivery to your PCB/battery build schedule
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
Costed BOM & quoting: line-item pricing, lead times, MOQs, and availability so you can make fast decisions
BOM scrub + data cleanup: validate part numbers/packaging/AML details so what’s on the BOM can actually be sourced and built
Lifecycle & shortage risk checks: flag NRND/EOL parts early and plan replacements before they become blockers
Alternates & second-sourcing: recommend vetted substitutes to reduce cost and lead time without breaking form/fit/function
Authenticity + traceability (on request): prioritize authorized sources when possible, with inspection/testing options and CoC/traceability documentation
Kitting + logistics coordination: consolidate parts into build-ready kits and align delivery to your PCB/battery build schedule
Custom lithium battery packs (Li-ion / LiPo / LiFePO4) for real-world products
Use cases: medical devices, robotics, e-bikes, and power tools
Built to your specs: voltage, capacity, size/form factor, and protection requirements
BMS included: selection, integration, balancing strategy, and safety protections
Design for manufacturability: enclosure/mechanical constraints, thermal considerations, and wiring layout
Prototype → production + compliance: documentation, test plans, and certificate support (UN 38.3 / IEC 62133 / UL 2054 / MSDS)
Prototype to production PCB design, from simple boards to complex multi-layer layouts
DFM-first approach to reduce respins, control cost, and improve yield
All technologies: single/double-sided, multi-layer, rigid, flex, and rigid-flex
Critical routing expertise for analog, digital, and mixed-signal designs
Analysis-driven optimization: signal integrity and thermal review (high-speed/RF capable)
Manufacturing-ready handoff: BOM + footprint review, alternate risk checks, and full fab/assembly outputs (Gerbers/ODB++, PnP, drawings)
Global sourcing, vendor management, and logistics solutions that reduce risk and keep your projects moving.
Certified processes, advanced testing methods, and strict compliance to ensure reliable, production-ready results.
Flexible solutions including quick-turn PCB assembly, turnkey production, and consignment builds.
Collaborative design support, component engineering, and test fixture development to reduce costs and accelerate time-to-market.