No products in the cart.
“Immersion Cooling Fluids” was added to the compare list
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
The SMTC engineering services team delivers a full range of design, engineering and manufacturing solutions across all our market sectors.
OSI Electronics offers turnkey solutions for the full range of assembly complexity. We partner with Customers on Product Development, New Product Introduction, Mass Production, Sustaining Engineering and Product Lifecycle Management. Our cutting edge technology, manufacturing proficiency and responsive technical services deliver the Tier One capabilities Customers require.
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
SMTC provides a broad range of Post-Production Services which enables our customers to minimize inventory exposure, eliminate multiple administrative costs, and increase response time to their own customers.
Our engineers can work as part of your team or take on complete product designs for you. Through close integration with our manufacturing group, we ensure that projects transition efficiently from design to prototype and into production.
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
The SMTC engineering services team delivers a full range of design, engineering and manufacturing solutions across all our market sectors.
OSI Electronics offers turnkey solutions for the full range of assembly complexity. We partner with Customers on Product Development, New Product Introduction, Mass Production, Sustaining Engineering and Product Lifecycle Management. Our cutting edge technology, manufacturing proficiency and responsive technical services deliver the Tier One capabilities Customers require.
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
SMTC provides a broad range of Post-Production Services which enables our customers to minimize inventory exposure, eliminate multiple administrative costs, and increase response time to their own customers.
Our engineers can work as part of your team or take on complete product designs for you. Through close integration with our manufacturing group, we ensure that projects transition efficiently from design to prototype and into production.
OSI Electronics offers turnkey solutions for the full range of assembly complexity. We partner with Customers on Product Development, New Product Introduction, Mass Production, Sustaining Engineering and Product Lifecycle Management. Our cutting edge technology, manufacturing proficiency and responsive technical services deliver the Tier One capabilities Customers require.
Our engineers can work as part of your team or take on complete product designs for you. Through close integration with our manufacturing group, we ensure that projects transition efficiently from design to prototype and into production.
Our displays division provides a wealth of experience in the design and fabrication of custom LCD and TFT modules and Display Assemblies for several industries.
OSI Electronics provides complete flex circuit and rigid-flex design, fabrication, and flex assembly solutions.
Fusion Application Board
Reliably connect the fusion board to SK-TDA4VM (Starter kit) using this Kit. This Kit includes a bracket , mounting hardware, power cable and connector and also instructions on how to connect the platforms together.
The SCIM1001 (Signal Conditioning Interface Module) is used to match the input and output characteristics of the AN/ARC-210 Integrated Communication System with digital subsystems in both air vehicle and ground support equipment. The Signal Conditioner inputs RS-422 UCARS-V2 asynchronous data and conditions it to meet the ARC-210 Black Wideband Transmit data requirement. The SCIM provides an interface for five DCP TX/RX pairs. Four of these signal pairs are routed to interface modules inside the SCIM for conversion to the appropriate levels for the ARC-210 while the fifth interface pair is routed directly to a UCARS interface connector. The module is powered with 28 Volts DC and it also creates the WB data input select and retransmit key signals. These discrete signals are active low enabling and are required by the RT-1794 ARC-210 for the Black Wideband Data Transmission per the IDS-988-6499-001 RT-1794 Interface Design Specification.
SMTC provides better, faster and more cost-effective solutions to our customers’ most challenging design for excellence (DFx) problems. From manufacturing to testing to supply chain, SMTC provides customized design support to our OEM partners, enabling them to establish a strong competitive position within their marketplace. SMTC’s product design excellence helps our customers minimize their component count, reduce costs and improve quality.
We have a proven record of guiding manufacturers throughout the entire electronics manufacturing process. From simple designs to complex system integration, SMTC provides the end-to-end electronics manufacturing services necessary to compete in a global marketplace.
The SMTC engineering services team delivers a full range of design, engineering and manufacturing solutions across all our market sectors.
SMTC provides a broad range of Post-Production Services which enables our customers to minimize inventory exposure, eliminate multiple administrative costs, and increase response time to their own customers.
Collaborative design support, component engineering, and test fixture development to reduce costs and accelerate time-to-market.