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TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
SMTC provides a broad range of Post-Production Services which enables our customers to minimize inventory exposure, eliminate multiple administrative costs, and increase response time to their own customers.
We offer custom design support, prototype development, and high-volume production to meet your specific project requirements with precision and consistency.
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
SMTC provides a broad range of Post-Production Services which enables our customers to minimize inventory exposure, eliminate multiple administrative costs, and increase response time to their own customers.
We offer custom design support, prototype development, and high-volume production to meet your specific project requirements with precision and consistency.
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
ASC proudly offers advanced RF microwave PCBs that use high frequency and heat sink technologies. We have extensive experience and technical expertise in the manufacturing of time critical, high technology RF circuits. We work closely with our worldwide customers to deliver prototype-to-high volume manufacturing of RF microwave PCBs.
Some of the suppliers of laminate / dielectric materials we utilize are: Nelco, Rogers, Isola, & Taconic. We manufacture high frequency PCBs with metal heat sinks for the telecommunication and aerospace industries. The heat sinks and RF Microwave PCBs are typically connected thermally and electrically. The metal heat sinks help with thermal dissipation and grounding of circuits. ASC uses commercially available pre-bonded and post-bonded materials for our RF microwave PCBs. Pre-bonded laminates are typically supplied by Rogers, Isola, or Taconic. Post-bonding is done via commercially available sheet film adhesive materials, ASC’s patented sheet film adhesives or sweat solder.
ASC has extensive experience and technical expertise in the manufacturing of time critical, high technology RF circuits.
Our high-quality Printed Circuit Board Assembly (PCBA) solutions are engineered for industrial, automotive, medical, telecommunications, and consumer electronics applications. We provide reliable PCB manufacturing, precision SMT & THT assembly, component sourcing, testing, and complete turnkey production with strict quality standards.
We offer custom design support, prototype development, and high-volume production to meet your specific project requirements with precision and consistency.