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Multi Layer
Multi-layer flexible circuits combine several single-sided or double-sided circuits with complex interconnections, shielding and/or surface mounted technologies in a multi-layer design. The number of conductor layers designed into multi-layer flex circuits are limitless. The package size, layer count vs. flexibility is considered during the design layout for ease of installation. Below is a slideshow of a four layer flex circuit for a digital camera application.
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RF/Microwave
RF/Microwave
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RF/Microwave
ASC proudly offers advanced RF microwave PCBs that use high frequency and heat sink technologies. We have extensive experience and technical expertise in the manufacturing of time critical, high technology RF circuits. We work closely with our worldwide customers to deliver prototype-to-high volume manufacturing of RF microwave PCBs.
Some of the suppliers of laminate / dielectric materials we utilize are: Nelco, Rogers, Isola, & Taconic. We manufacture high frequency PCBs with metal heat sinks for the telecommunication and aerospace industries. The heat sinks and RF Microwave PCBs are typically connected thermally and electrically. The metal heat sinks help with thermal dissipation and grounding of circuits. ASC uses commercially available pre-bonded and post-bonded materials for our RF microwave PCBs. Pre-bonded laminates are typically supplied by Rogers, Isola, or Taconic. Post-bonding is done via commercially available sheet film adhesive materials, ASC’s patented sheet film adhesives or sweat solder.
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