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TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
SMTC provides a broad range of Post-Production Services which enables our customers to minimize inventory exposure, eliminate multiple administrative costs, and increase response time to their own customers.
We offer custom design support, prototype development, and high-volume production to meet your specific project requirements with precision and consistency.
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
SMTC provides a broad range of Post-Production Services which enables our customers to minimize inventory exposure, eliminate multiple administrative costs, and increase response time to their own customers.
We offer custom design support, prototype development, and high-volume production to meet your specific project requirements with precision and consistency.
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
Our high-quality Printed Circuit Board Assembly (PCBA) solutions are engineered for industrial, automotive, medical, telecommunications, and consumer electronics applications. We provide reliable PCB manufacturing, precision SMT & THT assembly, component sourcing, testing, and complete turnkey production with strict quality standards.
TCLAD’s surface-mountable thermal bridge (SMTB) technology greatly improves heat spreading capacity across printed circuit boards (PCBs), reducing hotspots and enhancing overall thermal dissipation efficiency.
TCLAD immersion cooling fluids are high-performance liquid dielectrics engineered for efficient thermal management of densely packed, high-heat generating electronic systems. These fluids do not conduct electricity and are non-corrosive, allowing safe submersion of electronic equipment and direct heat transfer at the source.
TCLAD offers the industry’s most extensive range of dielectric materials, providing unmatched design flexibility across a variety of PCB formats
Thermal Clad dielectric film is easy to laminate, simplifying the fabrication of advanced multi-layer circuit boards.
TCLAD’s Insulated Metal Substrate (IMS®) solutions are purpose-built to meet the most demanding thermal challenges
ASC proudly offers advanced RF microwave PCBs that use high frequency and heat sink technologies. We have extensive experience and technical expertise in the manufacturing of time critical, high technology RF circuits. We work closely with our worldwide customers to deliver prototype-to-high volume manufacturing of RF microwave PCBs.
Some of the suppliers of laminate / dielectric materials we utilize are: Nelco, Rogers, Isola, & Taconic. We manufacture high frequency PCBs with metal heat sinks for the telecommunication and aerospace industries. The heat sinks and RF Microwave PCBs are typically connected thermally and electrically. The metal heat sinks help with thermal dissipation and grounding of circuits. ASC uses commercially available pre-bonded and post-bonded materials for our RF microwave PCBs. Pre-bonded laminates are typically supplied by Rogers, Isola, or Taconic. Post-bonding is done via commercially available sheet film adhesive materials, ASC’s patented sheet film adhesives or sweat solder.
Rigid flex circuits combine the benefits of rigid boards and flexible circuits integrated into one circuit. The two-in-one circuit is interconnected through plated through holes. Rigid flex circuits provide higher component density and better quality control. The slideshow below shows an eight layer rigid flex circuit used for a medical device. Four layers are rigid and four layers are flexible. There are connectors required on two different sides of the circuit, which is carrying signals and power.
Multi-layer flexible circuits combine several single-sided or double-sided circuits with complex interconnections, shielding and/or surface mounted technologies in a multi-layer design. The number of conductor layers designed into multi-layer flex circuits are limitless. The package size, layer count vs. flexibility is considered during the design layout for ease of installation. Below is a slideshow of a four layer flex circuit for a digital camera application.
Double-sided circuits have two layers of copper laminated between polyimide dielectrics. In most cases, the two layers of copper are electrically connected by drilling small holes through the copper circuits and the separating dielectric. The holes are then plated with copper to make a connection between them. The slideshow below shows the artwork required for each layer of the circuit build.
Single-sided flex circuits are the most basic type of flexible circuits. They have one layer of copper laminated between polyimide dielectrics. We chemically etch the copper layer to produce a circuit pattern specific to design requirements. Stiffeners, pins, connectors, and components, are optional. Single-sided flex circuits are durable across applications and are excellent for installations in with small spaces.